{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Intermetallic Study between Sn-Ag-Cu-Zn Solders and Copper Substrate: Wetting,Intermetallic Morphology and Thickness","author_name":"Ramani Mayappan","thumbnail_url":"https://www.ebooknetworking.net/books/384/547/big3845470011.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-3845470011.html\">Intermetallic Study between Sn-Ag-Cu-Zn Solders and Copper Substrate: Wetting,Intermetallic Morphology and Thickness</a>","width":400,"height":300}