{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Investigating voids: does a connection exist between pad finish and voiding in lead-free assemblies?(Cover Article): An article from: Circuits Assembly","author_name":"Keith Bryant","thumbnail_url":"https://www.ebooknetworking.net/books/noimage.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-B00082NVFG.html\">Investigating voids: does a connection exist between pad finish and voiding in lead-free assemblies?(Cover Article): An article from: Circuits Assembly</a>","width":400,"height":300}