{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Low formaldehyde emission particleboard bonded by UF-MDI mixture adhesive.(Technical Note): An article from: Forest Products Journal","author_name":"Weihong Wang, Xianquan Zang, Renshu Lu","thumbnail_url":"https://www.ebooknetworking.net/books/noimage.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-B00084B7UU.html\">Low formaldehyde emission particleboard bonded by UF-MDI mixture adhesive.(Technical Note): An article from: Forest Products Journal</a>","width":400,"height":300}