{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Thermal analysis of base materials through assembly: can current analytical techniques predict and characterize differences in laminate performance ... from: Printed Circuit Design & Manufacture","author_name":"Erik J. Bergum","thumbnail_url":"https://www.ebooknetworking.net/books/noimage.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-B0008DLC8S.html\">Thermal analysis of base materials through assembly: can current analytical techniques predict and characterize differences in laminate performance ... from: Printed Circuit Design &amp; Manufacture</a>","width":400,"height":300}