{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Voids, part 3: how to prevent voids during electroless copper deposition. (The Plating Rack).: An article from: Printed Circuit Design & Manufacture","author_name":"Michael Carano","thumbnail_url":"https://www.ebooknetworking.net/books/noimage.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-B0008DWSJU.html\">Voids, part 3: how to prevent voids during electroless copper deposition. (The Plating Rack).: An article from: Printed Circuit Design &amp; Manufacture</a>","width":400,"height":300}