{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Flip chip packaging: a hot topic: flip chip technology appears to be one bright spot in the electronics industry after a difficult year.(On the Forefront): An article from: Circuits Assembly","author_name":"E. Jan Vardaman","thumbnail_url":"https://www.ebooknetworking.net/books/noimage.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-B0008DYGA4.html\">Flip chip packaging: a hot topic: flip chip technology appears to be one bright spot in the electronics industry after a difficult year.(On the Forefront): An article from: Circuits Assembly</a>","width":400,"height":300}