{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Die skewing: due to the continued growth of flip-chip technology in next-generation products, avoiding die skew is essential.(Problem Solved): An article from: Circuits Assembly","author_name":"S. Craig Beddingfield, Brian Lewis","thumbnail_url":"https://www.ebooknetworking.net/books/noimage.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-B0008E2OXE.html\">Die skewing: due to the continued growth of flip-chip technology in next-generation products, avoiding die skew is essential.(Problem Solved): An article from: Circuits Assembly</a>","width":400,"height":300}