{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Reflow atmospheres in the lead-free era: a recent study examined the effects of several process variables on tin/silver and tin/silver/copper solder ... Free): An article from: Circuits Assembly","author_name":"Andy C. Mackie","thumbnail_url":"https://www.ebooknetworking.net/books/noimage.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-B0008E2WVS.html\">Reflow atmospheres in the lead-free era: a recent study examined the effects of several process variables on tin/silver and tin/silver/copper solder ... Free): An article from: Circuits Assembly</a>","width":400,"height":300}