{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Preventing voids in CSP and BGA underfill encapsulants: the right underfill can be as effective as the best solder paste.(Underfill Selection): An article from: Circuits Assembly","author_name":"Karl Loh, Edward Ibe","thumbnail_url":"https://www.ebooknetworking.net/books/noimage.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-B0009GLPHM.html\">Preventing voids in CSP and BGA underfill encapsulants: the right underfill can be as effective as the best solder paste.(Underfill Selection): An article from: Circuits Assembly</a>","width":400,"height":300}