{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Why a 2-D soldering pass won't (usually) improve hole-fill: optimized thermal design lies in board layout and placement.(Wave Soldering): An article from: Circuits Assembly","author_name":"Gerjan Diepstraten","thumbnail_url":"https://www.ebooknetworking.net/books/noimage.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-B000BKHSP4.html\">Why a 2-D soldering pass won&#039;t (usually) improve hole-fill: optimized thermal design lies in board layout and placement.(Wave Soldering): An article from: Circuits Assembly</a>","width":400,"height":300}