{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Die attach goes mainstream: for IC deposition, printer platforms are supplanting dispensers on die bonders.(Screen Printing): An article from: Circuits Assembly","author_name":"Clive Ashmore","thumbnail_url":"https://www.ebooknetworking.net/books/noimage.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-B000IZIY46.html\">Die attach goes mainstream: for IC deposition, printer platforms are supplanting dispensers on die bonders.(Screen Printing): An article from: Circuits Assembly</a>","width":400,"height":300}