{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Mathematical modeling of solder paste stenciling for process control: a DoE for characterizing solder paste stencil printing and measuring paste ... Deposits): An article from: Circuits Assembly","author_name":"Tim Wright","thumbnail_url":"https://www.ebooknetworking.net/books/noimage.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-B000NQDL48.html\">Mathematical modeling of solder paste stenciling for process control: a DoE for characterizing solder paste stencil printing and measuring paste ... Deposits): An article from: Circuits Assembly</a>","width":400,"height":300}