{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Copper plating and microvia fill for advanced PCBS: vertical in-line plating systems are well-suited for high-volume PCB manufacturing that requires ... An article from: Printed Circuit Design & Fab","author_name":"Bruce Chen","thumbnail_url":"https://www.ebooknetworking.net/books/noimage.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-B001K9JTYI.html\">Copper plating and microvia fill for advanced PCBS: vertical in-line plating systems are well-suited for high-volume PCB manufacturing that requires ... An article from: Printed Circuit Design &amp; Fab</a>","width":400,"height":300}