{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Electrodeposition of copper, Part 3: plating cell design can minimize the effects of primary current distribution.(POSITIVE PLATING): An article from: Printed Circuit Design & Fab","author_name":"Michael Carano","thumbnail_url":"https://www.ebooknetworking.net/books/noimage.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-B001K9JTZW.html\">Electrodeposition of copper, Part 3: plating cell design can minimize the effects of primary current distribution.(POSITIVE PLATING): An article from: Printed Circuit Design &amp; Fab</a>","width":400,"height":300}