{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Electroplating of copper, part 5: organic addition agents influence secondary current distribution and control the physical properties of the copper ... An article from: Printed Circuit Design & Fab","author_name":"Michael Carano","thumbnail_url":"https://www.ebooknetworking.net/books/noimage.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-B001QAOXEW.html\">Electroplating of copper, part 5: organic addition agents influence secondary current distribution and control the physical properties of the copper ... An article from: Printed Circuit Design &amp; Fab</a>","width":400,"height":300}