{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Tackling the copper wrap plate requirement: wrap plating improves reliability of via structures, but conventional techniques increase surface copper ... An article from: Printed Circuit Design & Fab","author_name":"Rajwant Sidhu","thumbnail_url":"https://www.ebooknetworking.net/books/noimage.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-B002HMJUWI.html\">Tackling the copper wrap plate requirement: wrap plating improves reliability of via structures, but conventional techniques increase surface copper ... An article from: Printed Circuit Design &amp; Fab</a>","width":400,"height":300}