{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"A novel Six Sigma SnPb solder paste: a new platform employed sophisticated statistical tools, eschewing traditional trial-and-error paste formulation.(Cover Story): An article from: Circuits Assembly","author_name":"Derrick Moyer, Steve Ratner, Martin Lopez, John McMaster, Frank Murch, Mike Skrzat","thumbnail_url":"https://www.ebooknetworking.net/books/noimage.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-B002HRXY7U.html\">A novel Six Sigma SnPb solder paste: a new platform employed sophisticated statistical tools, eschewing traditional trial-and-error paste formulation.(Cover Story): An article from: Circuits Assembly</a>","width":400,"height":300}