{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Information management gaps for board fabrication and assembly: progress toward complete data packages has been slow.(iNEMI ROADMAP): An article from: Circuits Assembly","author_name":"Eric Simmon","thumbnail_url":"https://www.ebooknetworking.net/books/noimage.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-B002RENS1K.html\">Information management gaps for board fabrication and assembly: progress toward complete data packages has been slow.(iNEMI ROADMAP): An article from: Circuits Assembly</a>","width":400,"height":300}