{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"3-D IC bonding: supply-chain roles are changing, with EMS firms expected to take a bigger chip-packaging role.(CHIP PACKAGING): An article from: Circuits Assembly","author_name":"Chris Sanders","thumbnail_url":"https://www.ebooknetworking.net/books/noimage.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-B002RENS2O.html\">3-D IC bonding: supply-chain roles are changing, with EMS firms expected to take a bigger chip-packaging role.(CHIP PACKAGING): An article from: Circuits Assembly</a>","width":400,"height":300}