{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Bridging technology between 3D conventional stacking and TSV 3D stacking: a new wirebond PoP achieves nearly 1000 interconnects at 200[micro]m ... An article from: Printed Circuit Design & Fab","author_name":"Belgacem Haba","thumbnail_url":"https://www.ebooknetworking.net/books/noimage.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-B00D03Y2HQ.html\">Bridging technology between 3D conventional stacking and TSV 3D stacking: a new wirebond PoP achieves nearly 1000 interconnects at 200[micro]m ... An article from: Printed Circuit Design &amp; Fab</a>","width":400,"height":300}