Books by John H. Lau — EbookNetworking.net

EbookNetworking 🔍 Search Books

📄 Lite AMP versionFull site ›

A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

3D IC Integration and Packaging
John H. Lau
180.00
View Details ›
Reliability of RoHS-Compliant 2D and 3D IC Interconnects (Electronic Engineering)
John H. Lau
116.99
View Details ›
Reliability of RoHS-Compliant 2D and 3D IC Interconnects
John H. Lau
10762
View Details ›
Reliability of RoHS-Compliant 2D and 3D IC Interconnects (Electronic Engineering)
John H. Lau
8199
View Details ›
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
John H. Lau
View Details ›
Ball Grid Array Technology
John H. Lau
View Details ›
Reliability of RoHS-Compliant 2D and 3D IC Interconnects (Electronics)
John H. Lau
2199.00
View Details ›
Low Cost Flip Chip Technologies for Dca, Wlcsp, and Pbga Assemblies (McGraw-Hill Professional Engineering)
John H. Lau
View Details ›
Ball Grid Array Technology (Electronic Packaging & Interconnection Series)
John H. Lau
View Details ›
Solder Joint Reliability: Theory and Applications
John H. Lau
339.00
View Details ›
Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)
John H. Lau
270.00
View Details ›
Handbook of Fine Pitch Surface Mount Technology (Electrical Engineering)
John H. Lau
View Details ›
Handbook Of Tape Automated Bonding
John H. Lau
299.00
View Details ›