Books by John H. Lau — EbookNetworking.net

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3D IC Integration and Packaging
John H. Lau
McGraw-Hill Education
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Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies
John H. Lau, Yi-Hsin Pao
McGraw-Hill Professional
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Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
John H. Lau
McGraw-Hill Professional
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Chip Scale Package: Design, Materials, Process, Reliability, and Applications
John H. Lau, Ricky S.W. Lee, S.W. Ricky Lee
McGraw-Hill Professional
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Ball Grid Array Technology
John H. Lau
McGraw-Hill Professional
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Microvias: For Low Cost, High Density Interconnects
John H. Lau, S.W. Ricky Lee
McGraw-Hill Professional
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Electronic Packaging: Design, Materials, Process, and Reliability
John H. Lau, C.P. Wong, J.L. Prince
McGraw-Hill Professional
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Solder Joint Reliability: Theory and Applications
John H. Lau
Springer
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Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)
John H. Lau
Springer
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Handbook of Fine Pitch Surface Mount Technology (Electrical Engineering)
John H. Lau
Springer
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Mechanics of Solder Alloy Interconnects (Electrical Engineering)
Darrel R. Frear, Steven N. Burchett, Harold S. Morgan, John H. Lau
Springer
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Handbook Of Tape Automated Bonding
John H. Lau
Springer
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