A comprehensive guide to TSV and other enabling technologies for 3D integration
Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed.
This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems.
Coverage includes:
- Nanotechnology and 3D integration for the semiconductor industry
- TSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealing
- TSVs: mechanical, thermal, and electrical behaviors
- Thin-wafer strength measurement
- Wafer thinning and thin-wafer handling
- Microbumping, assembly, and reliability
- Microbump electromigration
- Transient liquid-phase bonding: C2C, C2W, and W2W
- 2.5D IC integration with interposers
- 3D IC integration with interposers
- Thermal management of 3D IC integration
- 3D IC packaging