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Microelectronics Packaging Handbook on CD-ROM

Author Rao Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein
Publisher Springer
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160.61 348.00 USD
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Book Details
PublisherSpringer
ISBN / ASIN0412085615
ISBN-139780412085611
AvailabilityUsually ships in 24 hours
Sales Rank6,151,875
MarketplaceUnited States 🇺🇸

Description

The Microelectronics Packaging Handbook continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing processes. Now available on CD-ROM for the first time, it discusses state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. The CD-ROM version includes a navigational scheme for easy access to content, hypertext links for glossary terms, references, footnotes and graphics, and full text search capabilities for more powerful querying of the information.