Mechanics of Solder Alloy Interconnects (Electrical Engineering)

Name: Mechanics of Solder Alloy Interconnects (Electrical Engineering)
Author: Darrel R. Frear, Steven N. Burchett, Harold S. Morgan, John H. Lau
ISBN: 9780442015053

Author Darrel R. Frear, Steven N. Burchett, Harold S. Morgan, John H. Lau

Publisher Springer

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Book Details

Author(s)Darrel R. Frear, Steven N. Burchett, Harold S. Morgan, John H. Lau

PublisherSpringer

ISBN / ASIN0442015054

ISBN-139780442015053

AvailabilityUsually ships in 24 hours

Sales Rank4,707,806

MarketplaceUnited States 🇺🇸

Description ▲

The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.