VLSI 89: Proceedings of the IFIP TC 10/WG 10.5 International Conference on Very Large Scale Integration

Continuing the tradition established during the last decade, the latest VLSI volume breaks new ground, this time with such topics as Mechatronics and Three-Dimensional Chip Architectures. The selected research papers presented here have each been refereed by six people. Theoreticians in the field present their latest research, while cost-conscious practitioners demonstrate the reality of the field. In other words, the combination of breadth and depth should satisfy the most discerning readers and excite the younger generation, ensuring continued growth of the field.