Semiconductor Packaging: A Multidisciplinary Approach (Wiley Professional)

The creation of successful and reliable electronic products involves the interaction of electrical, mechanical, materials, and reliability engineering. This book covers all the physical systems, processes, and materials that a packaging engineer must confront and provides all the tools necessary to overcome a wide range of issues and problems. Features comprehensive, multidisciplinary, and up-to-date coverage. Includes copious reference data, graphs, tables and figures.