- Motivations and Justifications
- Architectures
- Component Hardware
- Technologies for System Integration and Packaging
- System Design
- Systems with Optical Interconnects
- Examples of Consortium Programs Sponsored by the U.S., European, and Japanese Governments.
Selected Papers on Optical Interconnects and Packaging (SPIE Milestone Series Vol. MS142)
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Book Details
Author(s)Sing H. Lee
PublisherSPIE Press
ISBN / ASIN0819427667
ISBN-139780819427663
AvailabilityUsually ships in 24 hours
Sales Rank13,038,337
CategoryTechnology & Engineering
MarketplaceUnited States 🇺🇸
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