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Copper Interconnect Technology (SPIE Tutorial Texts in Optical Engineering Vol. TT46)

Author Christoph Steinbruchel, Barry Chin
Publisher SPIE Publications
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Book Details
ISBN / ASIN0819438979
ISBN-139780819438973
AvailabilityUsually ships in 24 hours
Sales Rank8,194,920
MarketplaceUnited States 🇺🇸

Description

Copper interconnect technology is expected to be a key component in the quest to create more powerful CPUs and memory chips. This text examines the role of copper in future interconnects, presents the range of problems involved, and explains how the solutions are being found.

Contents

- Introduction
- Interconnect issues
- Copper deposition
- Copper patterning
- Interlayer dielectrics
- Cu/ILD barriers
- Current practice
- Index