This book describes techniques that can reduce mechanical-stress-induced inaccuracy and long-term instability in chips. The authors also show that the piezojunction effect can be applied for new types of mechanical-sensor structures. Thermo-mechanical stress is induced when packaged chips cool down to the temperature of application.
The Piezojunction Effect in Silicon Integrated Circuits and Sensors (The Springer International Series in Engineering and Computer Science)
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Book Details
Author(s)Fabiano Fruett, Gerard C.M. Meijer
PublisherSpringer
ISBN / ASIN1441952829
ISBN-139781441952820
MarketplaceUnited Kingdom 🇬🇧