Advanced Materials for Thermal Management of Electronic Packaging (Springer Series in Advanced Microelectronics)

Name: Advanced Materials for Thermal Management of Electronic Packaging (Springer Series in Advanced Microelectronics)
Author: Xingcun Colin Tong
ISBN: 9781441977588

Author Xingcun Colin Tong

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Book Details

Author(s)Xingcun Colin Tong

ISBN / ASIN1441977589

ISBN-139781441977588

MarketplaceUnited States 🇺🇸