The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Wafer Bonding
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Book Details
Author(s)M. Alexe, U. G÷sele
PublisherSpringer
ISBN / ASIN3540210490
ISBN-139783540210498
Sales Rank5,933,086
MarketplaceUnited States 🇺🇸