Encapsulation Technology for Electronic Application (Chinese Edition)

This book is about encapsulation technology for elctronic application, the latest work of Professor Haleh Ardebili in University of Houston and Professor Michael.G.Pecht in University of Maryland. The authors describes the basic principles of plastic technology and the packaging material and technical development. Furthermore, this book provides an extensive discussion on defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification process for encapsulated packages.