This digital document is an article from Circuits Assembly, published by UP Media Group, Inc. on June 1, 2004. The length of the article is 1819 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser.
Citation Details
Title: Investigating voids: does a connection exist between pad finish and voiding in lead-free assemblies?(Cover Article)
Author: Keith Bryant
Publication:Circuits Assembly (Magazine/Journal)
Date: June 1, 2004
Publisher: UP Media Group, Inc.
Volume: 15 Issue: 6 Page: 18(3)
Distributed by Thomson Gale
Investigating voids: does a connection exist between pad finish and voiding in lead-free assemblies?(Cover Article): An article from: Circuits Assembly
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Book Details
Author(s)Keith Bryant
PublisherUP Media Group, Inc.
ISBN / ASINB00082NVFG
ISBN-13978B00082NVF6
AvailabilityAvailable for download now
Sales Rank99,999,999
MarketplaceUnited States 🇺🇸