This digital document is an article from Circuits Assembly, published by UP Media Group, Inc. on April 1, 2005. The length of the article is 655 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser.
Citation Details
Title: Feinfocus' WBI-Fox x-ray: dynamic void detection in wafer bumps, without gray level definition.(Equipment Advances)
Author: Micha Lehnigk
Publication:Circuits Assembly (Magazine/Journal)
Date: April 1, 2005
Publisher: UP Media Group, Inc.
Volume: 16 Issue: 4 Page: 44(1)
Distributed by Thomson Gale
Feinfocus' WBI-Fox x-ray: dynamic void detection in wafer bumps, without gray level definition.(Equipment Advances): An article from: Circuits Assembly
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Book Details
Author(s)Micha Lehnigk
PublisherUP Media Group, Inc.
ISBN / ASINB0009H4V7C
ISBN-13978B0009H4V72
AvailabilityAvailable for download now
MarketplaceUnited States 🇺🇸