This digital document is an article from Circuits Assembly, published by Thomson Gale on February 1, 2007. The length of the article is 2280 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser.
Citation Details
Title: Mathematical modeling of solder paste stenciling for process control: a DoE for characterizing solder paste stencil printing and measuring paste bricks by 3-D AOI is described.(Optimizing Paste Deposits)
Author: Tim Wright
Publication:Circuits Assembly (Magazine/Journal)
Date: February 1, 2007
Publisher: Thomson Gale
Volume: 18 Issue: 2 Page: 75(6)
Distributed by Thomson Gale
Mathematical modeling of solder paste stenciling for process control: a DoE for characterizing solder paste stencil printing and measuring paste ... Deposits): An article from: Circuits Assembly
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Book Details
Author(s)Tim Wright
PublisherThomson Gale
ISBN / ASINB000NQDL48
ISBN-13978B000NQDL40
AvailabilityAvailable for download now
MarketplaceUnited States 🇺🇸