This digital document is an article from Circuits Assembly, published by UP Media Group, Inc. on July 1, 2009. The length of the article is 1669 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available immediately after purchase. You can view it with any web browser.
Citation Details
Title: A novel Six Sigma SnPb solder paste: a new platform employed sophisticated statistical tools, eschewing traditional trial-and-error paste formulation.(Cover Story)
Author: Derrick Moyer
Publication:Circuits Assembly (Magazine/Journal)
Date: July 1, 2009
Publisher: UP Media Group, Inc.
Volume: 20 Issue: 7 Page: 25(3)
Distributed by Gale, a part of Cengage Learning
A novel Six Sigma SnPb solder paste: a new platform employed sophisticated statistical tools, eschewing traditional trial-and-error paste formulation.(Cover Story): An article from: Circuits Assembly
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Book Details
PublisherUP Media Group, Inc.
ISBN / ASINB002HRXY7U
ISBN-13978B002HRXY79
AvailabilityAvailable for download now
Sales Rank99,999,999
MarketplaceUnited States 🇺🇸