This digital document is an article from American Journal of Applied Sciences, published by Science Publications on April 1, 2009. The length of the article is 3784 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available immediately after purchase. You can view it with any web browser.
From the author: Key words: 3D Stacked-die, design, leadframe, QFN, stress, thermo-mechanical
Citation Details
Title: Thermal-mechanical analysis of a different leadframe thickness of semiconductor package under the reflow process.(Report)
Author: S. Abdullah
Publication:American Journal of Applied Sciences (Magazine/Journal)
Date: April 1, 2009
Publisher: Science Publications
Volume: 6 Issue: 4 Page: 616(10)
Article Type: Report
Distributed by Gale, a part of Cengage Learning
Thermal-mechanical analysis of a different leadframe thickness of semiconductor package under the reflow process.(Report): An article from: American Journal of Applied Sciences
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Book Details
PublisherScience Publications
ISBN / ASINB002R9J1NE
ISBN-13978B002R9J1N0
AvailabilityAvailable for download now
MarketplaceUnited States 🇺🇸