Zero flash ultrasonic micro embossing on foamed polymer substrates: a proof of concept.(Report): An article from: Polymer Engineering and Science

This digital document is an article from Polymer Engineering and Science, published by Society of Plastics Engineers, Inc. on November 1, 2009. The length of the article is 4707 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available immediately after purchase. You can view it with any web browser.

From the author: This article reviews a novel method to produce micro-embossed features with an aspect ratio of three and negligible flash on polymer surfaces. An embossing technique that utilizes localized heating (ultrasonic energy) was used with polystyrene and polypropylene substrates. It was demonstrated that when foamed substrates were used, the amount of flash produced was negligible compared to nonfoamed substrates, which has been a significant unresolved problem with embossing using localized heating. The depth of microembossed features as a function of heating times and amplitudes of ultrasonic embossing is detailed in this article, along with a characterization of complex embossed geometries. It was seen that embossing depth was generally proportional to heating time and amplitude until the maximum feature depth was achieved. Although this article deals with embossing of microfeatures for lab-on-a-CD applications, it is envisioned that it is also suitable for lab-on-a-chip applications. POLYM. ENG. SCI., 49:2204-2211, 2009. [C] 2009 Society of Plastics Engineers

Citation Details
Title: Zero flash ultrasonic micro embossing on foamed polymer substrates: a proof of concept.(Report)
Author: Srikanth G. Vengasandra
Publication:Polymer Engineering and Science (Magazine/Journal)
Date: November 1, 2009
Publisher: Society of Plastics Engineers, Inc.
Volume: 49 Issue: 11 Page: 2204(8)

Article Type: Report

Distributed by Gale, a part of Cengage Learning