* 100% New Heatsink plaster.
* Application: apply to all heatsinkf no fixed clip thermal paste. Idea for MOSFET Heatsink,VGA CARD Northbridge Southbridge Heatsink.
* Features: thermal properties, strong adhesion
* Melting capacity: 0 (200 ℃ / 24Hours)
* Evaporation: 0.001% (200 ℃ / 24Hours)
* Thermal conductivity:> 1.2W/m-K
* Thermal Impedance: 5.1
* Dissipation coefficient
GENNEL G109 10gram Thermal Conductive Glue, Silicone Glue, Thermal Plaster, Silicone Viscous Adhesive Compound, Heatsink Glue for LED GPU MOSFET Printer Chipset IC High Performance
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9.99
USD
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Book Details
PublisherGENNEL
ISBN / ASINB072MSXHJD
ISBN-13978B072MSXHJ9
Sales Rank2,205
MarketplaceUnited States 🇺🇸
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