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UP Media Group, Inc.
Books by Publisher: UP Media Group, Inc.
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Used equipment vs. new asking the right questions: depending on your company's needs, used assembly equipment can often be a better buy than brand new ... An article from: Circuits Assembly
Steve O'Neil
UP Media Group, Inc.
5.95
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Making the 'centigrade': how Motorola tested--and approved--a lead-free solder paste.(Cover Story): An article from: Circuits Assembly
Vahid Goudarzi, Grahame Freeman
UP Media Group, Inc.
5.95
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The search for an ideal lead-free laminate: to make a wise decision, you'll have to understand the fundamental thermal properties of ... from: Printed Circuit Design & Manufacture
Chet Guiles, Ousama Najjar
UP Media Group, Inc.
5.95
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Will discoloration tarnish ImAg reliability? Watch for silver embrittlement and corrosion.(Tech Tips): An article from: Circuits Assembly
Gale Reference Team
UP Media Group, Inc.
9.95
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Flip chip packaging: a hot topic: flip chip technology appears to be one bright spot in the electronics industry after a difficult year.(On the Forefront): An article from: Circuits Assembly
E. Jan Vardaman
UP Media Group, Inc.
5.95
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The price is right: after a painful 18 months, our latest design industry snapshot shows a picture of improving health (and increasing wealth).(COVER ... An article from: Printed Circuit Design & Fab
Chelsey Drysdale
UP Media Group, Inc.
9.95
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Stub or no stub? Topology analysis can provide optimum system performance.(Interconnect Strategies): An article from: Printed Circuit Design & Manufacture
Abe Riazi
UP Media Group, Inc.
5.95
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Patent spoils.(OUR LINE)(Company overview): An article from: Printed Circuit Design & Fab
Kathy Nargi-Toth
UP Media Group, Inc.
9.95
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A 'disconnection approach' to cleaning process selection: breaking down cleaning processes into basic building blocks reveals the optimal ... An article from: Printed Circuit Design & Fab
Harald Wack
UP Media Group, Inc.
9.95
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Signal integrity applications of Mathcad, Part 2: Mathcad can solve complicated SI expressions including those with complex/ imaginary terms, ... An article from: Printed Circuit Design & Fab
Abe "Abbas" Riazi
UP Media Group, Inc.
9.95
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Preventing contamination-caused assembly failure: SIR must be designed for, especially in high-frequency boards.(PROCESS DOCTOR): An article from: Printed Circuit Design & Fab
Harald Wack
UP Media Group, Inc.
9.95
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Embedded resistor design guidelines: test vehicle development is continuing, and thermal guideline development has begun.(Getting Embedded): An article from: Printed Circuit Design & Manufacture
Richard C. Snogren, Mike Jouppi
UP Media Group, Inc.
5.95
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