Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging (Part 3) Buy on Amazon
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Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging (Part 3)

Author R.R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein
Publisher Springer
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Book Details
Author(s) R.R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein
Publisher Springer
ISBN / ASIN 0412084619
ISBN-13 9780412084614
Marketplace United States 🇺🇸
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