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Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging (Part 3) Buy on Amazon

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Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging (Part 3)

AuthorR.R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein
PublisherSpringer
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Book Details

Author(s)R.R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein
PublisherSpringer
ISBN / ASIN0412084619
ISBN-139780412084614
MarketplaceUnited States  🇺🇸

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