Home › Books › Microelectronics Packaging Handbook, 3-part set: Part I: Te…
Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging (Part 3) Buy on Amazon

https://www.ebooknetworking.net/books_detail-0412084619.html

Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging (Part 3)

AuthorR.R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein
PublisherSpringer
Shop on Amazon — choose your country
🇺🇸 USA 🇨🇦 Canada 🇬🇧 UK 🇩🇪 Germany 🇫🇷 France 🇮🇳 India
Buy New on Amazon 🇫🇷

Book Details

Author(s)R.R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein
PublisherSpringer
ISBN / ASIN0412084619
ISBN-139780412084614
MarketplaceFrance  🇫🇷

More Books by R.R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein

Microelectronics Packaging Handbook: Technology Drivers Part I (Pt. 1)
Microelectronics Packaging Handbook: Technology Driver…
View
Microelectronics Packaging Handbook, Part 2: Semiconductor Packaging (Pt. 1)
Microelectronics Packaging Handbook, Part 2: Semicondu…
View
Donate to EbookNetworking
Prev
Next