Failure Modes and Mechanisms in Electronic Packages
Book Details
Author(s)P. Singh, Puligandla Viswanadham
PublisherSpringer
ISBN / ASIN0412105918
ISBN-139780412105913
MarketplaceFrance 🇫🇷
Description
With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.
