Design and Analysis of Heat Sinks (Thermal Management of Microelectronic and Electronic System Series)
Book Details
Author(s)Allan D. Kraus, Avram Bar-Cohen
PublisherJohn Wiley & Sons
ISBN / ASIN0471017558
ISBN-139780471017554
AvailabilityUsually dispatched within 4-5 business days
Sales Rank1,073,154
CategoryTechnology & Engineering
MarketplaceIndia 🇮🇳
Description
A powerful methodology for producing superior thermal performance at low cost with minimum added mass . . .
Here is the only available comprehensive treatment of the design and analysis of heat sinks. It provides all the theoretical and practical information necessary to successfully design and/or select cost effective heat sinks for electronic equipment. The presentation includes detailed explanations of the governing heat transfer phenomena, complete coverage of thermal modeling tools for geometrically complex fin structures, and extensive discussion on recognizing thermal optimization opportunities.
Other topics covered include:
Fundamentals of heat transfer
Thermal modeling of electronic packages
Mathematical tools for heat sink analysis and design
Prevailing thermal transport processes
Models for a variety of fin geometries
Simple "transfer function" relations for single fin, cascaded fin, and fin array heat sinks
Thermal characterization and optimization of plate fin heat sinks
Completely self contained and filled with valuable information not available from any other single source, Design and Analysis of Heat Sinks is both a superior reference for accomplished thermal specialists and an excellent textbook for graduate courses in advanced thermal applications for mechanical engineering students. This book can also serve as a text in thermal science for students of electrical engineering.
Here is the only available comprehensive treatment of the design and analysis of heat sinks. It provides all the theoretical and practical information necessary to successfully design and/or select cost effective heat sinks for electronic equipment. The presentation includes detailed explanations of the governing heat transfer phenomena, complete coverage of thermal modeling tools for geometrically complex fin structures, and extensive discussion on recognizing thermal optimization opportunities.
Other topics covered include:
Fundamentals of heat transfer
Thermal modeling of electronic packages
Mathematical tools for heat sink analysis and design
Prevailing thermal transport processes
Models for a variety of fin geometries
Simple "transfer function" relations for single fin, cascaded fin, and fin array heat sinks
Thermal characterization and optimization of plate fin heat sinks
Completely self contained and filled with valuable information not available from any other single source, Design and Analysis of Heat Sinks is both a superior reference for accomplished thermal specialists and an excellent textbook for graduate courses in advanced thermal applications for mechanical engineering students. This book can also serve as a text in thermal science for students of electrical engineering.
