Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability Buy on Amazon
Facebook LinkedIn

Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability

Author Michael Pecht
Publisher Wiley-Interscience
Category Technology & Engineering
Shop on Amazon — pick your country
🇺🇸 USA 🇨🇦 Canada 🇬🇧 UK 🇩🇪 Germany 🇫🇷 France 🇮🇳 India
Buy New on Amazon 🇮🇳
Price not available for India

You can still browse on Amazon. Try another country above.

🇺🇸 USA
Book Details
Author(s) Michael Pecht
Publisher Wiley-Interscience
ISBN / ASIN 0471594466
ISBN-13 9780471594468
Category Technology & Engineering
Marketplace India 🇮🇳
Ratings & Reviews No reviews yet — be the first!

No reviews yet.

🏷️

More Books in Technology & Engineering

Fourth Dimension in Building: Strategies for Avoiding Obsolescence (<i>Studies in Management of Building Technology:</i> A Series)
Fourth Dimension in Building: Strategies for Avoiding …
View
Design and Evaluation of Rigid and Flexible Pavements, 1990 (Transportation Research Record)
Design and Evaluation of Rigid and Flexible Pavements,…
View
Nuclear Nonproliferation: Status Of U.s. Efforts To Improve Nuclear Material Controls In Newly Independent States
Nuclear Nonproliferation: Status Of U.s. Efforts To Im…
View
Time-Domain Numerical Methods for Modelling Antennas, RF/Microwave and EMC/EMI Structures (Industrial Innovation)
Time-Domain Numerical Methods for Modelling Antennas, …
View
The Rise of the Standard Model: A History of Particle Physics from 1964 to 1979
The Rise of the Standard Model: A History of Particle …
View
Synthesis, Properties and Crystal Chemistry of Perovskite-Based Material (Ceramic Transactions Series)
Synthesis, Properties and Crystal Chemistry of Perovsk…
View
Error Propagation in Environmental Modelling with GIS (Research Monographs in GIS)
Error Propagation in Environmental Modelling with GIS …
View
Crops And Environmental Change: An Introduction To Effects Of Global Warming, Increasing Atmospheric CO2 And O3 Concentrations, And Soil Salinization On Crop Physiology And Yield
Crops And Environmental Change: An Introduction To Eff…
View
Multicarrier Modulation with Low PAR: Applications to DSL and Wireless (The Springer International Series in Engineering and Computer Science)
Multicarrier Modulation with Low PAR: Applications to …
View
International Conference on Advanced Phase Measurement Methods in Optics and Imaging (AIP Conference Proceedings / Accelerators, Beams, and Instrumentations)
International Conference on Advanced Phase Measurement…
View
✍️

More Books by Michael Pecht

Handbook of Electronic Package Design (Mechanical Engineering)
Handbook of Electronic Package Design (Mechanical Engi…
View
China's Electronics Industry: The Definitive Guide for Companies and Policy Makers with Interest in China
China's Electronics Industry: The Definitive Guid…
View
Donate to EbookNetworking
← Previous Book Analysis Methods for RF, Mi... Next Book Fracture Mechanics: With an... →
← Previous Analysis Methods ...
Next Fracture Mechanic... →