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Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability

AuthorMichael Pecht
PublisherWiley-Interscience
CategoryTechnology & Engineering
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Book Details

Author(s)Michael Pecht
PublisherWiley-Interscience
ISBN / ASIN0471594466
ISBN-139780471594468
CategoryTechnology & Engineering
MarketplaceIndia  🇮🇳

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