Advanced Electronic Packaging (IEEE Press Series on Microelectronic Systems)

This book updates the book, Advanced Electronic Packaging: With Emphasis on Multichip Modules, Ed. W. D. Brown, IEEE Press, copyright 1999. The original edition of the book has been widely adopted by industry and has been and is still being adopted by universities for graduate courses. However, there is a need to redirect the focus away from multichip modules and toward current practices in electronic packaging. Since electronic packaging is a constantly and rapidly changing field, there is a continuing need to educate students, not only on the fundamentals of packaging, but also on current and future technologies. Much of the material contained in the first edition of the book, primarily the background material, has been transferred directly to the second edition. Several chapters on multichip modules (MCMs) have been eliminated, others have been updated, and new chapters have been added.