Chip Carriers, including: Dual In-line Package, Ball Grid Array, Surface-mount Technology, Pin Grid Array, Zig-zag In-line Package, Bga2, Flip Chip, ... Integrated Circuit Packaging, Die Attachment

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More info: A chip carrier, also known as a chip container or chip package, is a container for a transistor or an integrated circuit. The carrier usually provides metal leads, or "pins", which are sturdy enough to electrically and mechanically connect the fragile chip to a circuit board. This connection may be made by soldering or by mechanical force applied by springs or a ZIF socket. Most circuit boards today mount the chips on the surface of the board, although previously it was common to place the pins in through-holes punched into the board. As smaller packages are cheaper and ecologically safer, most modern chip carriers are too small for practical installation by humans. Modern microprocessors may have over 1000 pins, so the integrated circuit packaging technology to manufacture and install the carrier must be very reliable. * CERDIP: glass sealed ceramic DIP * DFN: Dual Flat Pack, No Lead * TDSP: True Die Size Package (same as TCSP) * μMAX: Similar to a SOIC. (A Maxim trademark ) * VQFB: Very-thin Quad Flat Pack * ZIP: Zig-zag in-line package * List of chip carriers * Chip carrier drawings *