Semiconductor Packages, including: Dual In-line Package, Ball Grid Array, Surface-mount Technology, Pin Grid Array, Zig-zag In-line Package, Bga2, ... Integrated Circuit Packaging, Uicc Buy on Amazon
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Semiconductor Packages, including: Dual In-line Package, Ball Grid Array, Surface-mount Technology, Pin Grid Array, Zig-zag In-line Package, Bga2, ... Integrated Circuit Packaging, Uicc

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Book Details
Author(s) Hephaestus Books
Publisher Hephaestus Books
ISBN / ASIN 1244302015
ISBN-13 9781244302013
Availability Usually ships in 24 hours
Marketplace United States 🇺🇸
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Description
Hephaestus Books represents a new publishing paradigm, allowing disparate content sources to be curated into cohesive, relevant, and informative books. To date, this content has been curated from Wikipedia articles and images under Creative Commons licensing, although as Hephaestus Books continues to increase in scope and dimension, more licensed and public domain content is being added. We believe books such as this represent a new and exciting lexicon in the sharing of human knowledge. This particular book contains chapters focused on Semiconductor packages, and Chip carriers.

More info: A semiconductor package is a molded plastic or ceramic casing inside which is embedded one or more discrete or integrated electronic components which may be connected and used within an electronic circuit. The discrete components are typically etched in silicon wafer before being cut and assembled in a packaged.
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