Semiconductor Packages, including: Dual In-line Package, Ball Grid Array, Surface-mount Technology, Pin Grid Array, Zig-zag In-line Package, Bga2, ... Integrated Circuit Packaging, Uicc Buy on Amazon

https://www.ebooknetworking.net/books_detail-1244302015.html

Semiconductor Packages, including: Dual In-line Package, Ball Grid Array, Surface-mount Technology, Pin Grid Array, Zig-zag In-line Package, Bga2, ... Integrated Circuit Packaging, Uicc

Book Details

ISBN / ASIN1244302015
ISBN-139781244302013
MarketplaceFrance  🇫🇷

Description

Hephaestus Books represents a new publishing paradigm, allowing disparate content sources to be curated into cohesive, relevant, and informative books. To date, this content has been curated from Wikipedia articles and images under Creative Commons licensing, although as Hephaestus Books continues to increase in scope and dimension, more licensed and public domain content is being added. We believe books such as this represent a new and exciting lexicon in the sharing of human knowledge. This particular book contains chapters focused on Semiconductor packages, and Chip carriers.

More info: A semiconductor package is a molded plastic or ceramic casing inside which is embedded one or more discrete or integrated electronic components which may be connected and used within an electronic circuit. The discrete components are typically etched in silicon wafer before being cut and assembled in a packaged.

More Books by Hephaestus Books

Donate to EbookNetworking
Prev
Next