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Three-Dimensional Molded Interconnect Devices (3D-MID)

AuthorJörg Franke
PublisherHanser
CategoryTechnology & Engineering
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Book Details

Author(s)Jörg Franke
PublisherHanser
ISBN / ASIN1569905517
ISBN-139781569905517
CategoryTechnology & Engineering
MarketplaceFrance  🇫🇷

Description

Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers

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